Company Filing History:

8 out of 9,638

Hewlett-packard Company

patents

2 out of 832,680

Other

patents

Years Active: 1988-2001

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10 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 6242075 - Planar multilayer ceramic structures with near surface channels (2001-06-05),

2. 5633535 - Spacing control in electronic device assemblies (1997-05-27),

3. 5399528 - Multi-layer fabrication in integrated circuit systems (1995-03-21),

4. 5221421 - Controlled etching process for forming fine-geometry circuit lines on a (1993-06-22),

5. 5200300 - Methods for forming high density multi-chip carriers (1993-04-06),

6. 5162260 - Stacked solid via formation in integrated circuit systems (1992-11-10),

7. 5086335 - Tape automated bonding system which facilitate repair (1992-02-04),

8. 5055425 - Stacked solid via formation in integrated circuit systems (1991-10-08),

9. 5029386 - Hierarchical tape automated bonding method (1991-07-09),

10. 4782381 - Chip carrier (1988-11-01),

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Company Filing History:

Years Active: 1988-2001