The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 1991
Filed:
Sep. 17, 1990
Clinton C Chao, Redwood City, CA (US);
Kim K Chen, Fremont, CA (US);
Jacques Leibovitz, San Jose, CA (US);
Edith P Prather, Redwood City, CA (US);
Hewlett-Packard Company, Palo Alto, CA (US);
Abstract
A system and method of interconnecting a first tape automated bonding frame to a substrate so as to facilitate replacement by a second automated bonding frame. The automated bonding frame is formed to include a plurality of signal leads having a pattern of outer lead ends. A semiconductor chip is attached to the inner lead ends of the frame. Connection sites are formed on the substrate to correspond to the pattern of outer lead ends. The substrate bonds of the connection sites to the substrate have a first bonding strength. The outer lead ends are then attached to the connection sites to achieve a second bonding strength less than the first bonding strength. Thus, an application of force on the outer lead ends tends to separate the outer lead ends from the connection sites while leaving the substrate bonds intact. Preferably, the tensile strength of the signal leads is less than both of the above-described bonding strengths. In this manner, the signal leads can be broken prior to peeling of the outer lead ends from the connection sites of the substrate.