Location History:
- Jung he, TW (2003 - 2004)
- Hsinchu, TW (2006 - 2013)
Company Filing History:
Years Active: 2003-2013
Title: The Innovative Contributions of Chung-Yu Wang
Introduction
Chung-Yu Wang is an esteemed inventor based in Hsin-Chu, Taiwan, with a remarkable portfolio of seven patents. He is recognized for his significant contributions to the field of semiconductor packaging, particularly in the development of advanced light-emitting device (LED) technologies and fabrication methods.
Latest Patents
Two of Chung-Yu Wang's latest patents illustrate his innovative approach to semiconductor packaging. The first, titled "LED flip-chip package structure with dummy bumps," introduces a unique light-emitting device package component that features an LED chip and carrier chip integration through flip-chip bonding. This design includes a dummy through-substrate via (TSV) which does not conduct current, ensuring efficient performance for the LED chip.
His second patent, "Method for fabricating a semiconductor package including stress relieving layer for flip chip packaging," outlines a comprehensive technique for creating semiconductor packages. This method emphasizes the proper alignment of conductive layers with exposed via plugs, enhancing the reliability of the bonding process and overall package performance.
Career Highlights
Chung-Yu Wang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, where he leverages his expertise to drive innovation in semiconductor technology. His extensive experience and successful patent portfolio position him as a key contributor within his field.
Collaborations
Throughout his career, Chung-Yu has collaborated with notable professionals such as Pei-Haw Tsao and Chender Huang. These partnerships enhance his research and development efforts, fostering an environment of shared knowledge and creativity in technology.
Conclusion
Chung-Yu Wang continues to make significant strides in the technological realm of semiconductor packaging. His innovative patents reflect a commitment to advancing device efficiency and reliability, cementing his reputation as a leader in his field.