This inventor holds 4 USPTO granted patents and 1 published patent application. Top assignees: Asm Technology Singapore Pte Ltd, Asm Assembly Automation Limited. Active years: 2014-2020.
Company Filing History:
3 out of 234 
1 out of 124 Years Active: 2014-2020
Title: Chung Yan Lau - Innovator in Semiconductor Technology
Introduction
Chung Yan Lau is a prominent inventor based in Hong Kong, CN. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His innovative approaches have enhanced the efficiency and effectiveness of wire bonding processes in semiconductor manufacturing.
Latest Patents
One of his latest patents focuses on the detection of foreign particles during wire bonding. This method involves collecting operating characteristics of a bonding tool while forming a wire bond. It determines whether a possible bonding failure has occurred based on these characteristics. If a potential failure is detected, an image of the wire bond is captured to identify any foreign bodies present on the surface. This targeted imaging approach increases the throughput of the wire bonding apparatus while effectively identifying and classifying bonding defects.
Another notable patent is for a pick and place device that includes a pick arm correction module. This semiconductor die pick and place device features a handling mechanism with a pick arm that moves between placement and pick-up locations. A light reflecting module on the pick arm reflects an image of a reference feature to an image capturing module, ensuring that the reference feature appears in focus at a virtual position equivalent to the pick-up or placement location.
Career Highlights
Chung Yan Lau has worked with several notable companies in the semiconductor industry, including ASM Technology Singapore Pte Ltd and ASM Assembly Automation Limited. His experience in these organizations has allowed him to develop and refine his innovative techniques in wire bonding and semiconductor handling.
Collaborations
Chung has collaborated with talented individuals such as Hing Suen Siu and Yu Sze Cheung. These partnerships have contributed to the advancement of his projects and the successful implementation of his patented technologies.
Conclusion
Chung Yan Lau's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His innovative methods continue to enhance the efficiency of wire bonding processes, making a significant impact on semiconductor manufacturing.