Asm Technology Singapore Pte Ltd

Asm Assembly Automation Limited

Chung Yan Lau

Chi Wah Cheng

Kui Kam Lam

Yu Sze Cheung

Jiangwen Deng

Zhuanyun Zhang

Kai Siu Lam

Nim Tak Wong

Hing Suen Siu

Ran Shi Wang

Tact Lee

Chin Kei Lai

A method of bonding wires onto surfaces, an apparatus and a computer program product are disclosed. The method of bonding wires onto surfaces, comprises the steps of: collecting operating characteristics of a bonding tool while forming a wire bond which bonds a wire to a surface; determining whether a possible bonding failure of the wire bond has occurred as indicated by the operating characteristics; and capturing an image of the wire bond to identify whether a foreign body is present on the surface if it is determined that a possible bonding failure has occurred. In this way, imaging of the wire bond is only necessary when the operating characteristics indicate a suspect bonding failure has occurred. This avoids the need to image every bond, while still imaging suspect bonds. This approach helps to significantly increase the throughput of the wire bonding apparatus whilst still identifying and classifying bonding defects due to the presence of a foreign body.

Detection of foreign particles during wire bonding

A semiconductor die pick and place device comprising a handing mechanism comprising a pick arm movable between a placement location and a pick-up location. A reference feature is located on the pick arm, and a light reflecting module is carried by the pick arm. The light reflecting module is operable to reflect an image of the reference feature to an image capturing module such that the reference feature appears to the light reflecting module to be in focus at a virtual position that is equivalent to a position at the pick-up location and/or the placement location.

Pick and place device comprising pick arm correction module

Disclosed is an apparatus for handling electronic components. The apparatus comprises: i) a rotary device and a plurality of pick heads arranged circumferentially around the rotary device, each pick head being operable to hold an electronic component; ii) a position-determining device for determining an arrangement of the electronic components as held by the respective pick heads; iii) a fiducial mark arranged in a position that is indicative of the arrangement of the electronic components, as determined by the position-determining device; iv) a first imaging device arranged relative to the fiducial mark; and v) at least one handling device for handling the electronic components. Specifically, the first imaging device is operable to capture at least one image comprising the fiducial mark and the at least one handling device so that a position of the at least one handling device is adjustable to align the at least one handling device with respect to the arrangement of the electronic components, based on an offset between the fiducial mark and the at least one handling device as derived from the at least one image captured by the first imaging device. A method of adjusting the position of at least one handling device of an apparatus for handling electronic components is also disclosed.

Apparatus and method of using an imaging device for adjustment of at least one handling device for handling semiconductor components

A method for inspecting a substrate having intrinsic heterogeneous patterns for the presence of cracks comprises the steps of providing an optical device and front-side lighting on a first side of the substrate and providing near-infrared lighting on a second side of the substrate opposite to the first side. The near-infrared lighting is operable to penetrate the substrate so as to be detectable by the optical device through the substrate. One or more images are obtained by illuminating the substrate with the front-side lighting and/or the near-infrared lighting from the second side. The one or more images are thereafter processed to distinguish between the heterogeneous patterns on the substrate and any cracks present on the substrate.

Method for inspecting a photovoltaic substrate

Growing community of inventors

Hong Kong, China

Chung Yan Lau