Tainan, Taiwan

Chung-Wei Huang

This inventor holds 2 USPTO granted patents. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Global Unichip Corporation. Active years: 2022-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chung-Wei Huang. Retrieved from https://idiyas.com/inventor/chung-wei-huang-c48mfcbi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.9

ph-index = 1


Location History:

  • Hsinchu, TW (2022)
  • Tainan, TW (2024)

Company Filing History:


Years Active: 2022-2024

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2 patents (USPTO):Explore Patents

Title: The Innovative Journey of Inventor Chung-Wei Huang

Introduction: Chung-Wei Huang, a talented inventor hailing from Tainan, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Chung-Wei Huang holds several patents in the areas of electronics and software development, with his most recent patent focusing on a cutting-edge artificial intelligence algorithm for autonomous vehicles.

Career Highlights: Throughout his illustrious career, Chung-Wei Huang has worked for top tech companies, leading research institutions, and prestigious universities, where he has spearheaded innovative projects and research initiatives that have pushed the boundaries of technology.

Collaborations: Chung-Wei Huang has collaborated with renowned engineers, scientists, and researchers from around the world, fostering a culture of innovation and knowledge sharing that has resulted in groundbreaking inventions and technological advancements.

Conclusion: Chung-Wei Huang's passion for innovation, coupled with his relentless pursuit of excellence, has solidified his reputation as a visionary inventor in the tech industry. His contributions have not only transformed the way we think about technology but have also paved the way for a more connected and technologically advanced future.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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