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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11279001 B1

PDFFull Text
Date of Patent:
Mar. 22, 2022

Filed:

Feb. 22, 2019

Method and apparatus for monitoring chemical mechanical polishing process

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Chung-Wei Huang, Hsinchu, TW;

Ren-Hao Jheng, Hsinchu County, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;

Attorney:

Maschoff Brennan

Primary Examiner:

Joseph J Hail

Assistant Examiner:

Arman Milanian

Int. Cl.
CPC ...
B24B 37/005 (2012.01); B24B 49/12 (2006.01); B24B 53/00 (2006.01); B24B 53/017 (2012.01); B24B 57/02 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
B24B 49/12 (2013.01); B24B 37/005 (2013.01); B24B 53/005 (2013.01); B24B 53/017 (2013.01); B24B 57/02 (2013.01); H01L 21/02013 (2013.01); H01L 21/67092 (2013.01);
Abstract

A method of monitoring a chemical mechanical polishing (CMP) apparatus including an arm configured to swing a polishing component includes performing a CMP process; learning at least two positions of the polishing component during a normal swing motion of the polish component by an optical acceptor and a processing unit to determine a plurality of expected positions of the polish component; analyzing at least one real position of the polishing component at predetermined time points during the CMP process by the optical acceptor and the processing unit; inspecting whether an abnormal event occurs based on the analyzed real position of the polishing component and the expected positions by the processing unit during the CMP process; and determining whether to send an alarm and stop the CMP process based on the inspecting result.

Find Patent Forward Citations

Huang, Chung-Wei. (2022). Method and apparatus for monitoring chemical mechanical polishing process (U.S. Patent No. 11279001). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11279001

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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