Taitung, Taiwan

Chung-Wei Hsu

This inventor holds 4 USPTO granted patents. Top assignee: Winbond Electronics Corporation. Active years: 2015-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chung-Wei Hsu. Retrieved from https://idiyas.com/inventor/chung-wei-hsu-qxgrstv2

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.2

ph-index = 1

Forward Citations = 10(Granted Patents)


Location History:

  • Taitung County, TW (2016)
  • Taitung, TW (2015 - 2018)

Company Filing History:


Years Active: 2015-2018

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4 patents (USPTO):Explore Patents

Title: **Innovative Contributions of Chung-Wei Hsu in RRAM Technology**

Introduction

Chung-Wei Hsu, an influential inventor based in Taitung, Taiwan, has made significant strides in the field of resistive random access memory (RRAM) technology. With a total of four patents to his name, his inventions reflect an exceptional understanding of electronic materials and structures, which are crucial for the advancement of memory storage solutions.

Latest Patents

Hsu's latest patents include groundbreaking advancements in RRAM cell structures. One notable innovation is the "Self-rectifying RRAM cell structure having two resistive switching layers with different bandgaps." This patent elaborates on a cell structure that consists of a first electrode layer made from a nitride of a first metal element and a second electrode layer made of a different metal element. The configuration features a first resistive switching layer placed between these electrodes, which has a lower bandgap compared to the second switching layer. Such innovative designs aim to enhance the efficiency and performance of memory devices.

Another patent, the "Self-rectifying resistive random access memory cell structure," presents a unique architecture that includes an insulator-metal-transition material layer, which is central to the cell's operation. This patent highlights Hsu's commitment to pioneering new solutions that push the boundaries of current RRAM technologies.

Career Highlights

Chung-Wei Hsu is currently associated with Winbond Electronics Corporation, a leader in the semiconductor industry. His work revolves around the development of advanced memory solutions, where he applies his expertise in electronic material science to drive innovation in memory devices. With four patents under his belt, Hsu's contributions play a vital role in the ongoing evolution of RRAM technology.

Collaborations

Collaboration has been pivotal to Hsu's innovative journey. He has worked alongside prominent colleagues such as Tuo-Hung Hou and Chun-Tse Chou. Together, they have contributed to the research and development efforts at Winbond Electronics Corporation, fostering an environment of shared knowledge and innovation that aims to address the challenges of modern memory technology.

Conclusion

In summary, Chung-Wei Hsu stands out as a prominent inventor in the realm of RRAM technology. His inventive prowess, demonstrated through his patents and collaborations, underscores his commitment to advancing electronic storage solutions. As the demand for efficient and high-capacity memory systems continues to grow, Hsu's contributions will undoubtedly play a crucial role in shaping the future of this industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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