Taichung, Taiwan

Chun-Min Wang

This inventor holds 2 USPTO granted patents. Top assignees: Unimicron Technology Corporation, United Microelectronics Corp.. Active years: 2013-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chun-Min Wang. Retrieved from https://idiyas.com/inventor/chun-min-wang-jgp3b4fp

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.4

ph-index = 1


Company Filing History:


Years Active: 2013-2021

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2 patents (USPTO):Explore Patents

Title: Innovations of Chun-Min Wang

Introduction

Chun-Min Wang is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on advanced package structures and stress film forming methods, which are crucial for the development of modern electronic devices.

Latest Patents

Wang's latest patents include a package structure and method of manufacturing the same. This innovative package structure features a redistribution structure, a chip, an inner conductive reinforcing element, and a protective layer. The redistribution structure consists of a first circuit layer and a second circuit layer, which are electrically connected. The chip is positioned over the redistribution structure and is also electrically connected to the second circuit layer. The inner conductive reinforcing element, which has a Young's modulus ranging from 30 to 200 GPa, is placed over the redistribution structure. The protective layer encases the chip and the sidewall of the inner conductive reinforcing element's opening.

Another significant patent by Wang is the stress film forming method and stress film structure. This method is utilized in the fabrication process of semiconductor devices. Initially, a substrate is provided, where both a first-polarity-channel MOSFET and a second-polarity-channel MOSFET are formed. A deposition-curing cycle process is then performed to create a cured stress film over both types of MOSFETs. Following this, an additional deposition process forms a non-cured stress film on top of the cured stress film, resulting in a seamless stress film.

Career Highlights

Chun-Min Wang has worked with prominent companies in the semiconductor industry, including Unimicron Technology Corporation and United Microelectronics Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking innovations in semiconductor technology.

Collaborations

Wang has collaborated with notable colleagues such as Cheng-Ta Ko and An-Chi Liu. These partnerships have further enhanced his research and development efforts in the field.

Conclusion

Chun-Min Wang's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry, paving the way for future innovations in electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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