Company Filing History:
2 out of 124 
1 out of 234 
Years Active: 2010-2019
Title: Innovations of Chun Hung Samuel Ip
Introduction
Chun Hung Samuel Ip is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on improving methods and apparatuses for bonding semiconductor devices.
Latest Patents
One of his latest patents is the "Die attachment apparatus and method utilizing activated forming gas." This invention involves a die attachment apparatus designed for attaching a semiconductor die onto a substrate with a metallic surface. It features a material dispensing station that dispenses bonding material onto the substrate and a die attachment station that places the semiconductor die onto the dispensed bonding material. An activating gas generator is positioned before the die attachment station to introduce activated forming gas onto the substrate, effectively reducing oxides on the surface.
Another significant patent is the "Method of bonding semiconductor devices utilizing solder balls." This method outlines the process of bonding a semiconductor device onto a substrate. It includes steps such as picking up a solder ball with a pick head, placing the solder ball onto the substrate, and melting the solder ball before placing the semiconductor device on it. The molten solder ball cools to form a solder joint, effectively bonding the semiconductor device to the substrate.
Career Highlights
Chun Hung Samuel Ip has worked with several prominent companies in the semiconductor industry. He has been associated with ASM Assembly Automation Limited and ASM Technology Singapore Pte Ltd. His experience in these organizations has contributed to his expertise in semiconductor device bonding technologies.
Collaborations
Some of his notable coworkers include Kui Kam Lam and Ping Liang Tu. Their collaboration has likely fostered innovation and development in their respective fields.
Conclusion
Chun Hung Samuel Ip's contributions to semiconductor technology through his patents and career experiences highlight his role as an influential inventor. His innovative methods for bonding semiconductor devices continue to impact the industry positively.