Chun Hui Yu

Title: Innovations of Chun Hui Yu

Introduction

Chun Hui Yu is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of engineering, particularly in the development of advanced packaging technologies. With a total of 2 patents, his work has garnered attention for its innovative approaches.

Latest Patents

Chun Hui Yu's latest patents include a method for forming a filling paste structure of wafer level packages. This patent discloses a process that involves filling an adhesive material among a plurality of dice and covering them. The dice are adhered to a glue pattern formed on a removable substrate, and a rigid substrate is coated with adhesive material to secure the dice. The process allows for the removal of the dice from the glue pattern in a special environment after attaching the rigid base substrate.

Another significant patent is for a FBGA and COB package structure for image sensors. This structure features a die placed on a printed circuit board, with a glass substrate adhered to an adhesive film pattern. This design creates an air gap area between the glass substrate and the chip, while micro lenses are disposed on the chip. The glass substrate serves to prevent particle contamination of the micro lenses, enhancing the reliability of the package.

Career Highlights

Chun Hui Yu is currently employed at Advanced Chip Engineering Technology, Inc. His work at this company has been pivotal in advancing packaging technologies that are crucial for modern electronics. His innovative designs have contributed to the efficiency and effectiveness of semiconductor packaging.

Collaborations

Chun Hui Yu has collaborated with notable colleagues, including Wen-Kun Yang and Wen-Bin Sun. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Chun Hui Yu's contributions to the field of engineering through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry positively, paving the way for future innovations in packaging technology.