Advanced Chip Engineering Technology, Inc.

Chun Hui Yu

Wen-Kun Yang

Wen-Bin Sun

Jui-Hsien Chang

Chin-Chen Yang

His-Ying Yuan

Hsi-Ying Yuan

A filling paste structure and process of wafer level package is disclosed. The process comprises filling an adhesive material to fill among plurality of dice and cover the plurality of dice. The pluralities of dice are adhered to glue pattern with viscosity in common state formed on a removable substrate. A rigid substrate is coated by adhesive material to adhere the dice. Then, pluralities of dice are departed from the glue pattern by a special environment after attaching the rigid base substrate.

Method for forming filling paste structure of WL package

A structure of package comprises a die placed on printed circuit board. A glass substrate is adhered on an adhesive film pattern to form an air gap area between the glass substrate and the chip. Micro lens are disposed on the chip. A lens holder is fixed on printed circuit board. The glass substrate can prevent the micro lens from particle contamination.

FBGA and COB package structure for image sensor

Growing community of inventors

Tainan, Taiwan

Chun Hui Yu