The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 09, 2007

Filed:

Jan. 05, 2005
Applicants:

Wen-kun Yang, Hsin-Chu, TW;

Chin-chen Yang, Taipei, TW;

Wen-bin Sun, Taipei, TW;

Jui-hsien Chang, Jhudong Township, Hsinchu County, TW;

Chun Hui Yu, Tainan, TW;

His-ying Yuan, Taoyuan, TW;

Inventors:

Wen-Kun Yang, Hsin-Chu, TW;

Chin-Chen Yang, Taipei, TW;

Wen-Bin Sun, Taipei, TW;

Jui-Hsien Chang, Jhudong Township, Hsinchu County, TW;

Chun Hui Yu, Tainan, TW;

His-Ying Yuan, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A structure of package comprises a die placed on printed circuit board. A glass substrate is adhered on an adhesive film pattern to form an air gap area between the glass substrate and the chip. Micro lens are disposed on the chip. A lens holder is fixed on printed circuit board. The glass substrate can prevent the micro lens from particle contamination.


Find Patent Forward Citations

Yang, Wen-Kun. (2007). Fbga and cob package structure for image sensor (U.S. Patent No. 7279782). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7279782

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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