Taoyuan, Taiwan

Chun-Heng Wu

This inventor holds 19 USPTO granted patents and 14 published patent applications. Top assignee: Nan Ya Technology Corporation. Active years: 2020-2025.

USPTO Granted Patents = 19 

% Patents Active = 100.0

Average Co-Inventor Count = 1.6

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2020-2025

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19 patents (USPTO):Explore Patents

Title: Innovations of Chun-Heng Wu: Pioneering Semiconductor Technologies

Introduction

Chun-Heng Wu, a prominent inventor located in Taoyuan, Taiwan, has made significant contributions to the field of semiconductor technology. With an impressive portfolio of 19 patents, Wu's work embodies cutting-edge innovations that address critical challenges in the semiconductor manufacturing process.

Latest Patents

Among Chun-Heng Wu's latest patents is the "Method of Forming Semiconductor Structure." This patent describes a comprehensive process that includes forming a dielectric stack over a substrate, followed by the development of a mask layer and openings that enable capacitor formation within the semiconductor structure. The meticulous details of this method highlight the importance of precision in semiconductor fabrication.

Another notable patent is the "Method for Fabricating Crown Capacitor." This innovation outlines a process that involves creating supporting and sacrificial layers, culminating in the formation of a first electrode layer with a unique wavy structure. The method emphasizes efficient etching processes and the careful arrangement of materials to enhance capacitor performance.

Career Highlights

Chun-Heng Wu is associated with Nan Ya Technology Corporation, where he has been instrumental in advancing semiconductor technologies through his innovative patents. His extensive expertise in material science and semiconductor processes positions him as a key figure in the industry, contributing to the company's reputation as a leader in technology.

Collaborations

Wu often collaborates with fellow inventors Jen-I Lai and Jr-Chiuan Wang. Their combined efforts in research and development have paved the way for new solutions in semiconductor engineering, showcasing the power of teamwork in driving innovation.

Conclusion

Chun-Heng Wu’s contributions to semiconductor technology are crucial as they not only enhance device performance but also facilitate the continual progress of the industry. His inventive spirit and collaborative efforts with prominent colleagues reflect a dedication to overcoming technological challenges and shaping the future of electronics.

Profile summary based on public USPTO records.
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