Company Filing History:
Years Active: 2003-2006
Introduction
Chuan-Chieh Huang is a notable inventor based in Hsin-Chu, Taiwan, recognized for his contributions to semiconductor manufacturing. With a total of five patents to his name, Huang continues to push the boundaries of innovation in the field of etching and dielectric layer formation.
Latest Patents
Huang's latest innovations include two significant patents that enhance the processes involved in semiconductor device fabrication. The first patent, titled "Method to Improve Etching of Resist Protective Oxide (RPO) to Prevent Photo-Resist Peeling," details an advanced two-step etching method. This method utilizes a combination of plasma and wet etching techniques to achieve superior dimensional control and prevent resist mask peeling, which has wide applicability in semiconductor processes.
The second patent, "Method to Improve Via or Contact Hole Profile Using an In-situ Polymer Deposition and Strip Procedure," presents a novel approach to forming narrow diameter openings in insulator layers. By integrating multiple plasma procedures, Huang's method results in vertical profile shapes that enhance the effectiveness of the insulator layer, thereby improving the accuracy of semiconductor device creation.
Career Highlights
Chuan-Chieh Huang is affiliated with Taiwan Semiconductor Manufacturing Company (TSMC), a global leader in semiconductor fabrication. His work at TSMC has placed him at the forefront of semiconductor technology, allowing him to contribute significantly to innovative practices in the industry. His achievements reflect a deep understanding of material interactions and etching processes.
Collaborations
Huang has collaborated with esteemed colleagues, including Jyh-Shiou Hsu and Pin-Yi Hsin. Their teamwork has facilitated the development of cutting-edge techniques that have the potential to revolutionize semiconductor manufacturing processes.
Conclusion
Chuan-Chieh Huang stands out as an influential inventor in the field of semiconductor technology. His latest patents demonstrate a commitment to innovation and an ability to address complex challenges within the industry. With ongoing collaborations and contributions at TSMC, Huang will likely continue to shape the future of semiconductor fabrication.