This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2010.
Company Filing History:
Years Active: 2010
Title: Innovations of Chu-Wei Cheng
Introduction
Chu-Wei Cheng is a notable inventor based in Pingzhen, Taiwan. He has made significant contributions to the field of microelectronics, particularly through his innovative patent related to wafer bonding. His work is essential in advancing the manufacturing processes of microelectronic devices.
Latest Patents
Chu-Wei Cheng holds a patent titled "Process for wafer bonding." This patent outlines a method for manufacturing a microelectronic device. The method includes several steps, such as forming a top metal layer on a first substrate, which features a plurality of interconnect features and a first dummy feature. It also involves forming a first dielectric layer over the top metal layer, etching the dielectric layer in a target region aligned with the interconnect features, performing a chemical mechanical polishing (CMP) process, and bonding the first substrate to a second substrate. This innovative approach enhances the efficiency and effectiveness of microelectronic device manufacturing.
Career Highlights
Chu-Wei Cheng is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His role at the company allows him to apply his expertise in microelectronics and contribute to cutting-edge technologies.
Collaborations
Some of his notable coworkers include Fa-Yuan Chang and Tsung-Mu Lai. Their collaboration in the field of microelectronics has likely fostered an environment of innovation and creativity.
Conclusion
Chu-Wei Cheng's contributions to the field of microelectronics through his patent on wafer bonding exemplify his innovative spirit and dedication to advancing technology. His work continues to impact the industry positively.