Taiwan Semiconductor Manufacturing Comp. Ltd.

Chu-Wei Cheng

Chia-Shiung Tsai

Yuan-Chih Hsieh

Ming-Chyi Liu

Hua-Shu Ivan Wu

Gwo-Yuh Shiau

Kai-Chih Liang

Tsung-Mu Lai

Fa-Yuan Chang

Ching-Chung Pai

Nick Y M Shen

Chin-Hsiang Ho

The present disclosure provide a method of manufacturing a microelectronic device. The method includes forming a top metal layer on a first substrate, in which the top metal layer has a plurality of interconnect features and a first dummy feature; forming a first dielectric layer over the top metal layer; etching the first dielectric layer in a target region substantially vertically aligned to the plurality of interconnect features and the first dummy feature of the top metal layer; performing a chemical mechanical polishing (CMP) process over the first dielectric layer; and thereafter bonding the first substrate to a second substrate.

Process for wafer bonding

Growing community of inventors

Pingjhen, Taiwan

Chu-Wei Cheng