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Seongnam-si, South Korea

Choong Bin Yim

USPTO Granted Patents = 13

Average Co-Inventor Count = 2.4

ph-index = 5

Forward Citations = 164(Granted Patents)

Location History:

Kyungki-do, KR (2007)
Seongnam-si, KR (2007 - 2013)

Company Filing History:

13 out of 1,812

Stats Chippac Pte. Ltd.

Years Active: 2007-2013

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13 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8530280 - Integrated circuit package system with contoured encapsulation and method for manufacturing thereof (2013-09-10),

2. 8367465 - Integrated circuit package on package system (2013-02-05),

3. 8049322 - Integrated circuit package-in-package system and method for making thereof (2011-11-01),

4. 7985623 - Integrated circuit package system with contoured encapsulation (2011-07-26),

5. 7884460 - Integrated circuit packaging system with carrier and method of manufacture thereof (2011-02-08),

6. 7755180 - Integrated circuit package-in-package system (2010-07-13),

7. 7679169 - Stacked integrated circuit leadframe package system (2010-03-16),

8. 7501697 - Integrated circuit package system (2009-03-10),

9. 7482203 - Stacked integrated circuit package-in-package system (2009-01-27),

10. 7446396 - Stacked integrated circuit leadframe package system (2008-11-04),

11. 7312519 - Stacked integrated circuit package-in-package system (2007-12-25),

12. 7298037 - Stacked integrated circuit package-in-package system with recessed spacer (2007-11-20),

13. 7288835 - Integrated circuit package-in-package system (2007-10-30),

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