Choong Bin Yim is a prominent inventor based in Seongnam-si, South Korea. He has made significant contributions to the field of integrated circuit packaging, holding a total of 13 patents. His work focuses on enhancing the efficiency and reliability of electronic components.

Latest Patents

Among his latest patents is an innovative integrated circuit package system with contoured encapsulation. This method involves providing a carrier, mounting an integrated circuit die on the carrier's top side, and forming an encapsulation with a multi-sloped side to reduce ejection stress. Additionally, he has developed an integrated circuit package on package system, which includes a base substrate with a stackable connection and a base integrated circuit that is encapsulated for enhanced performance.

Career Highlights

Choong Bin Yim is currently employed at Stats Chippac Pte. Ltd., where he continues to push the boundaries of technology in integrated circuit packaging. His expertise has led to advancements that are crucial for the electronics industry.

Collaborations

He has collaborated with notable coworkers, including Hyeog Chan Kwon and Jong-Woo Ha, contributing to various projects that enhance the capabilities of integrated circuit technologies.

Conclusion

Choong Bin Yim's innovative work in integrated circuit packaging has established him as a key figure in the electronics field. His patents reflect a commitment to improving technology and efficiency in electronic components.

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