The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2007
Filed:
Feb. 17, 2006
Choong Bin Yim, Seongnam-si, KR;
Sungmin Song, Inchon, KR;
Seongmin Lee, Seoul, KR;
Jaehyun Lim, Seoul, KR;
Joungin Yang, Kyongkido, KR;
Dongsam Park, Ichon-si, KR;
Choong Bin Yim, Seongnam-si, KR;
Sungmin Song, Inchon, KR;
SeongMin Lee, Seoul, KR;
Jaehyun Lim, Seoul, KR;
Joungin Yang, Kyongkido, KR;
DongSam Park, Ichon-si, KR;
Stats Chippac Ltd., Singapore, SG;
Abstract
A stacked integrated circuit package-in-package system is provided forming a first integrated circuit spacer package including a mold compound with a recess provided therein, stacking the first integrated circuit spacer package on an integrated circuit die on a substrate with the recess positioned therebetween, and attaching a first electrical interconnect extending from the recess and connected between the integrated circuit die and the substrate.