The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2007
Filed:
Jan. 12, 2006
Sungmin Song, Inchon, KR;
Choong Bin Yim, Kyungki-do, KR;
Seongmin Lee, Seoul, KR;
Jaehyun Lim, Seoul, KR;
Joungin Yang, Kyongkido, KR;
Dongsam Park, Kyonggi-do, KR;
Sungmin Song, Inchon, KR;
Choong Bin Yim, Kyungki-do, KR;
Seongmin Lee, Seoul, KR;
Jaehyun Lim, Seoul, KR;
Joungin Yang, Kyongkido, KR;
Dongsam Park, Kyonggi-do, KR;
Stats Chippac Ltd., Singapore, SG;
Abstract
A stacked integrated circuit package-in-package system is provided forming a first device having a first integrated circuit package comprises forming a first substrate with a first integrated circuit thereon, electrically connecting first electrical interconnects between the first integrated circuit and a top side of the first substrate, encapsulating a first top molding compound to cover the first electrical interconnects and a portion of the top side of the first substrate, and encapsulating a first bottom molding compound to cover the first integrated circuit and a bottom side the first substrate, and stacking a second device, having a second integrated circuit package, below the first device with a second top molding compound of the second device providing a space between the first device and the second device, wherein the second device includes the second top molding compound and a second bottom molding compound in a similar manner to the first device.