Stats Chippac Pte. Ltd.

Choong Bin Yim

Jong-Woo Ha

Hyeog Chan Kwon

Jaehyun Lim

SeongMin Lee

Sungmin Song

DongSam Park

Joungin Yang

Young Cheol Kim

In Sang Yoon

Dongsam Park

A method for manufacturing an integrated circuit package system includes: providing a carrier; mounting an integrated circuit die on a top side of the carrier; connecting the integrated circuit die with the carrier; forming an encapsulation having a multi-sloped side over the integrated circuit die for reducing ejection stress; and forming a first external interconnect on the top side of the carrier adjacent to and separated from the encapsulation including forming a second external interconnect on a bottom side of the carrier opposite the first external interconnect.

Integrated circuit package system with contoured encapsulation and method for manufacturing thereof

A integrated circuit package on package system is provided including providing a base substrate having a base stackable connection, attaching a base integrated circuit on the base substrate, forming a stackable package including the base integrated circuit encapsulated with the base stackable connection partially exposed, and attaching a bottom package on the stackable package.

Integrated circuit package on package system

A method for making an integrated circuit package-in-package system includes: forming a first integrated circuit package including a first device and a first substrate and having a first interface; stacking a second integrated circuit package including a second device and a second substrate and having a second interface above the first integrated circuit package; and fitting the first interface directly on the second interface.

Integrated circuit package-in-package system and method for making thereof

An integrated circuit package system is provided including providing a carrier, mounting an integrated circuit die on the carrier, connecting the integrated circuit die with the carrier, and forming an encapsulation having a multi-sloped side over the integrated circuit die for reducing ejection stress.

Integrated circuit package system with contoured encapsulation

A method of manufacture of an integrated circuit packaging system includes: forming a carrier having a top side and a bottom side; forming an edge terminal pad on the top side and an inner terminal pad on the bottom side; connecting an integrated circuit die to an inner portion of the edge terminal pad; and encapsulating the integrated circuit die and the inner portion of the edge terminal pad with the outer portion of the edge terminal pad exposed.

Integrated circuit packaging system with carrier and method of manufacture thereof

An integrated circuit package-in-package system is provided forming a first integrated circuit package having a first interface, stacking a second integrated circuit package having a second interface above the first integrated circuit package, fitting the first interface and the second interface, and attaching a third integrated circuit package on the second integrated circuit package.

Integrated circuit package-in-package system

A stacked integrated circuit leadframe package system including forming a leadframe, packaging a top integrated circuit on a one side of the leadframe, packaging a bottom integrated circuit on an opposite side of the leadframe, and forming external electrical interconnects on the leadframe.

Stacked integrated circuit leadframe package system

An integrated circuit package system is provided forming a carrier having a top side and a bottom side, forming an edge terminal pad on the top side and an inner terminal pad on the bottom side, connecting an integrated circuit die to an inner portion of the edge terminal pad, and encapsulating the integrated circuit die and the inner portion of the edge terminal pad with the outer portion of the edge terminal pad exposed.

Integrated circuit package system

A stacked integrated circuit package-in-package system is provided forming a first device having a first integrated circuit package comprises forming a first substrate with a first integrated circuit thereon, electrically connecting first electrical interconnects between the first integrated circuit and a top side of the first substrate, encapsulating a first top molding compound to cover the first electrical interconnects and a portion of the top side of the first substrate, and encapsulating a first bottom molding compound to cover the first integrated circuit and a bottom side the first substrate, and stacking a second device, having a second integrated circuit package, below the first device with a second top molding compound of the second device providing a space between the first device and the second device, wherein the second device includes the second top molding compound and a second bottom molding compound in a similar manner to the first device.

Stacked integrated circuit package-in-package system

A stacked integrated circuit package-in-package system is provided forming a first integrated circuit spacer package including a mold compound with a recess provided therein, stacking the first integrated circuit spacer package on an integrated circuit die on a substrate with the recess positioned therebetween, and attaching a first electrical interconnect extending from the recess and connected between the integrated circuit die and the substrate.

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Seongnam-si, South Korea

Choong Bin Yim