Zhubei, Taiwan

Chin-Wei Liang

USPTO Granted Patents = 35 

Average Co-Inventor Count = 4.0

ph-index = 5

Forward Citations = 68(Granted Patents)


Location History:

  • Hsin-Chu, TW (2018)
  • Hsinchu County, TW (2015 - 2022)
  • Zhubei, TW (2015 - 2024)

Company Filing History:


Years Active: 2015-2025

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35 patents (USPTO):Explore Patents

Chin-Wei Liang is a Taiwanese innovator who has made significant contributions to the field of semiconductor technology. Based in Zhubei, Taiwan, Chin-Wei Liang has been awarded 29 patents throughout his career, with his latest two patents being particularly noteworthy.

His first patent is for a technique to inhibit delamination from flowable gap-fill dielectric. This technology involves the use of an interfacial layer that binds a hydrophilic interlayer dielectric to a hydrophobic gap-filling dielectric. The latter is formed through a flowable CVD process and extends over and fills gaps between devices in an array of devices disposed between two metal interconnect layers over a semiconductor substrate. The interfacial layer provides a hydrophilic upper surface to which the interlayer dielectric adheres, consequently preventing delamination. Furthermore, the interfacial layer may also be formed through a flowable CVD process and may have a wafer contact angle intermediate between the WCA of the hydrophobic dielectric and the WCA of the interlayer dielectric. He developed this technique while he was working in Taiwan Semiconductor Manufacturing Company Limited.

The second patent of Chin-Wei Liang is for techniques used in forming image sensors with organic photodiodes. According to this technology, trenches are formed in organic photodiodes that increase the PN-junction interfacial area, improving the quantum efficiency of the photodiodes. The organic P-type material is then applied in liquid form to fill the trenches. Similarly, a mixture of P-type materials with different work function values and thickness may be used to meet the desired work function for the photodiodes. This technology holds significant promise for the future of image sensors and the semiconductor industry as a whole.

Chin-Wei Liang developed these techniques with the help of his colleagues from Taiwan Semiconductor Manufacturing Company Limited, including Cheng-Yuan Tsai and Chia-Shiung Tsai. Together, they have made significant contributions to the field of semiconductor technology, which is continually advancing and evolving. Chin-Wei Liang's latest patents are just a glimpse into the exciting innovations that are taking place in this field.

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