Company Filing History:
Years Active: 2003-2006
Title: Innovations by Chin-Tsan Jan
Introduction
Chin-Tsan Jan is a notable inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on improving the efficiency and safety of wafer processing systems.
Latest Patents
One of his latest innovations is the "Wafer Protection System." This system is designed to protect wafers from damage caused by inaccurately-positioned wafer transfer robot blades during the transfer process. The system includes a conductor foil that is electrically separated from the robot blade, which connects to a relay circuit. Upon contact with the wafer, the conductor foil deforms, completing a circuit that terminates power to the robot blade motor, thus preventing further movement and potential damage.
Another significant patent is the "CMP Apparatus Polishing Head with Concentric Pressure Zones." This polishing head features multiple concentric pressure zones that allow for selective increases in polishing pressure against specific regions of a semiconductor wafer. This innovation compensates for variations in polishing rates caused by surface non-uniformities. The design includes inflatable pressure rings that can be selectively inflated to enhance polishing efficiency.
Career Highlights
Chin-Tsan Jan is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in advancing wafer processing technologies, contributing to the company's reputation for innovation and quality.
Collaborations
Throughout his career, Chin-Tsan Jan has collaborated with esteemed colleagues such as Jiann-Lih Wu and Chen-Chia Chiu. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and technological advancements.
Conclusion
Chin-Tsan Jan's contributions to semiconductor technology through his innovative patents demonstrate his commitment to enhancing wafer processing systems. His work continues to influence the industry and pave the way for future advancements.