The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2004
Filed:
Jan. 09, 2002
Chin-Tsan Jan, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd, Hsin Chu, TW;
Abstract
A method and system for monitoring tension associated with a robot-controlled belt utilized in a semiconductor wafer polishing apparatus. A belt tension monitor can be adapted for use with the semiconductor wafer polishing apparatus to detect a variable tension of the robot-controlled belt. An upper tension limit and a lower tension limit of the robot-controlled belt may then be monitored utilizing the belt tension monitor to prevent a breakage of the robot-controlled belt during a semiconductor wafer polishing operation thereby extending a life of the robot-controlled belt. The belt tension monitor can be installed at an inertial pulley of a robot associated with the semiconductor wafer polishing apparatus to detect the variable tension of the robot-controlled belt.