The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2006

Filed:

Mar. 27, 2003
Applicant:

Chin-tsan Jan, Hsinchu, TW;

Inventor:

Chin-Tsan Jan, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G05F 19/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A system for protecting wafers from damage caused by an inaccurately-positioned wafer transfer robot blade during the transfer of wafers typically from a wafer cassette to a processing tool. The wafer protection system includes a conductor foil which is electrically separated from the robot blade through a space or gap and is connected to a relay circuit that is normally closed to facilitate flow of electrical power to the robot blade motor. Upon initial contact of the robot blade with the edge of a wafer, the conductor foil deforms and contacts the blade through the space or gap, completing a circuit between the blade and the relay circuit. The relay circuit opens, thereby terminating further power flow to the robot blade motor and immediately preventing further movement of the robot blade against the wafer.


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