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For the Inventor, By the Inventor

San Jose, CA, United States of America

Chin-Ching Huang

USPTO Granted Patents = 10

Average Co-Inventor Count = 1.8

ph-index = 7

Forward Citations = 116(Granted Patents)


Location History:

  • San Jose, CA (US) (1992 - 1997)
  • Saratoga, CA (US) (1998 - 2000)

Company Filing History:

goldMedal10 out of 1,083 
 
Vlsi Technology, Inc.
 patents

Years Active: 1992-2000

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10 patents (USPTO):Explore Patents
1. 6047467 - Printed circuit board layout to minimize the clock delay caused by (2000-04-11),
2. 5742009 - Printed circuit board layout to minimize the clock delay caused by (1998-04-21),
3. 5641988 - Multi-layered, integrated circuit package having reduced parasitic noise (1997-06-24),
4. 5625225 - Multi-layered, integrated circuit package having reduced parasitic noise (1997-04-29),
5. 5371403 - High performance package using high dielectric constant materials for (1994-12-06),
6. 5371321 - Package structure and method for reducing bond wire inductance (1994-12-06),
7. 5302022 - Technique for measuring thermal resistance of semiconductor packages and (1994-04-12),
8. 5259545 - Apparatus for bonding a semiconductor die to a package using a (1993-11-09),
9. 5188982 - Method of bonding a semiconductor die to a package using a gold/silicon (1993-02-23),
10. 5138431 - Lead and socket structures with reduced self-inductance (1992-08-11),

Title: Innovations of Chin-Ching Huang

Introduction

Chin-Ching Huang is a prominent inventor based in San Jose, CA. He has made significant contributions to the field of printed circuit board technology. With a total of 10 patents to his name, Huang has developed innovative solutions that address critical challenges in electronic design.

Latest Patents

Huang's latest patents focus on minimizing signal delays in printed circuit boards. One of his notable inventions is a method for minimizing signal delays caused by mismatches in the length of the inner leads of a package lead frame. This innovation features a unique conductive trace pattern that can be formed on either the top or lower surface of an electrically-insulated, heat-conducting printed circuit board. The design includes a plurality of U-shaped metallized traces, each with varying lengths. This ensures that certain traces adjacent to the inner leads at the center of the package lead frame are longer than those at the corners. This conductive trace pattern not only minimizes signal delays but also aids in heat transfer away from the encapsulated integrated-circuit die.

Career Highlights

Chin-Ching Huang has been instrumental in advancing technologies at VLSI Technology, Inc. His work has significantly impacted the efficiency and performance of electronic devices. His innovative designs have been recognized within the industry for their effectiveness in addressing complex engineering challenges.

Collaborations

Huang has collaborated with notable colleagues, including Ahmad B Hamzehdoost and Sang S Lee. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Chin-Ching Huang's contributions to printed circuit board technology exemplify the spirit of innovation. His patents reflect a deep understanding of electronic design and a commitment to improving performance in the field. His work continues to influence the industry and inspire future advancements.

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