Chin-Chia Yang

Title: The Innovative Contributions of Chin-Chia Yang

Introduction

Chin-Chia Yang is a prominent inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work focuses on enhancing the performance and reliability of semiconductor structures.

Latest Patents

One of his latest patents is titled "Warpage-reducing semiconductor structure and fabricating method of the same." This innovative structure includes a wafer that features a front side and a back side. Numerous semiconductor elements are strategically disposed at the front side, while a silicon oxide layer is placed at the back side. A UV-transparent silicon nitride layer covers and contacts the silicon oxide layer, with its refractive index ranging between 1.55 and 2.10. This design aims to reduce warpage in semiconductor structures, thereby improving their functionality.

Career Highlights

Chin-Chia Yang is currently employed at United Microelectronics Corporation, a leading company in the semiconductor industry. His expertise and innovative approach have positioned him as a key figure in the development of advanced semiconductor technologies.

Collaborations

Throughout his career, Chin-Chia Yang has collaborated with notable colleagues, including Da-Jun Lin and Bin-Siang Tsai. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Chin-Chia Yang's contributions to semiconductor technology are noteworthy, particularly his focus on warpage reduction in semiconductor structures. His work continues to influence the industry and pave the way for future innovations.