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For the Inventor, By the Inventor

Taoyuan, Taiwan

Chih-Wei Ho

This inventor holds 4 USPTO granted patents. Top assignee: Xintec Corporation. Active years: 2015-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chih-Wei Ho. Retrieved from https://idiyas.com/inventor/chih-wei-ho-q5av08hy

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 4

% Patents Active = 100.0

Average Co-Inventor Count = 4.3

ph-index = 1

Forward Citations = 4(Granted Patents)


Location History:

  • Zhongli, TW (2015)
  • Zongli, TW (2016)
  • Taoyuan, TW (2017)

Company Filing History:

goldMedal4 out of 203 
 
Xintec Corporation
 patents

Years Active: 2015-2017

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4 patents (USPTO):Explore Patents
1. 9633935 - Stacked chip package including substrate with recess adjoining side edge of substrate and method for forming the same (2017-04-25),
2. 9613904 - Semiconductor structure and manufacturing method thereof (2017-04-04),
3. 9230927 - Method of fabricating wafer-level chip package (2016-01-05),
4. 9153528 - Chip package and method for forming the same (2015-10-06),

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Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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