The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
A stacked chip package is provided. The stacked chip package includes a first substrate having a first side and a second side opposite thereto. The first substrate includes a recess therein. The recess adjoins a side edge of the first substrate. A plurality of redistribution layers is disposed on the first substrate and extends onto the bottom of the recess. A second substrate is disposed on the first side of the first substrate. A plurality of bonding wires is correspondingly disposed on the redistribution layers in the recess, and extends onto the second substrate. A device substrate is disposed on the second side of the first substrate. A method of forming the stacked chip package is also provided.
Ho, Yen-Shih. (2017). Stacked chip package including substrate with recess adjoining side edge of substrate and method for forming the same (U.S. Patent No. 9633935). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9633935
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
