Chih-Ping Wang

Title: Chih-Ping Wang: Innovator in Semiconductor Technology

Introduction

Chih-Ping Wang is a notable inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on innovative semiconductor structures that enhance performance and reliability.

Latest Patents

Chih-Ping Wang's latest patents include advanced semiconductor structures. The first patent describes a semiconductor structure that consists of a carrier, a first protective layer, a second protective layer, and a third protective layer. This design features a first anti-stress zone on the first surface of the first protective layer. The structure is engineered to optimize stress distribution, with specific projection lines and intersection points that define the anti-stress zones. The second patent also outlines a semiconductor structure with similar components, emphasizing the importance of anti-stress zones in maintaining structural integrity.

Career Highlights

Chih-Ping Wang is currently employed at Chipbond Technology Corporation, where he continues to innovate in semiconductor technology. His expertise has positioned him as a key player in the development of cutting-edge semiconductor solutions.

Collaborations

Chih-Ping Wang has collaborated with notable colleagues, including Chin-Tang Hsieh and You-Ming Hsu. These partnerships have fostered a collaborative environment that enhances the innovation process within the company.

Conclusion

Chih-Ping Wang's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the field. His work continues to influence advancements in semiconductor structures, showcasing the importance of innovation in technology.