Company Filing History:
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Years Active: 2014-2023
Title: Chih Hong Wang: Innovator in Semiconductor Technology
Introduction
Chih Hong Wang is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on innovative methods and apparatuses that enhance the performance and reliability of semiconductor devices.
Latest Patents
Wang's latest patents include an "Apparatus including solder-core connectors and methods of manufacturing the same." This patent discloses semiconductor devices that feature continuous-core connectors, which are designed to provide an electrical path using uniform material. Another notable patent is for a "Semiconductor device assembly with graded modulus underfill and associated methods and systems." This invention involves underfill materials with graded moduli for semiconductor device assemblies, allowing for improved mechanical properties and performance. The underfill material is engineered to create regions with different elastic moduli, enhancing the reliability of the semiconductor device assembly.
Career Highlights
Throughout his career, Chih Hong Wang has worked with notable organizations such as Micron Technology Incorporated and National Yang Ming Chiao Tung University. His experience in these institutions has allowed him to develop and refine his innovative ideas in semiconductor technology.
Collaborations
Wang has collaborated with esteemed colleagues, including Jungbae Lee and Po Chih Yang. These partnerships have contributed to the advancement of his research and the successful development of his patented technologies.
Conclusion
Chih Hong Wang is a distinguished inventor whose work in semiconductor technology has led to several impactful patents. His innovative approaches continue to shape the future of the industry, demonstrating the importance of research and collaboration in technological advancement.