Taipei, Taiwan

Chih-Hao Chen

This inventor holds 31 USPTO granted patents and 9 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Amazing Microelectronic Corporation, Academia Sinica. Active years: 2008-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chih-Hao Chen. Retrieved from https://idiyas.com/inventor/chih-hao-chen-2n0xs02a

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 31 

% Patents Active = 96.8

Average Co-Inventor Count = 4.4

ph-index = 3

Forward Citations = 35(Granted Patents)


Company Filing History:


Years Active: 2008-2025

Loading Chart...
Areas of Expertise:
Semiconductor Package
Heat Dissipation
Thermal Interface Material
Manufacturing Method
Integrated Circuit
Adhesive
Electronic Device
High Voltage
ESD Protection
Package Structure
Benzimidazole Compounds
Keyboard Backlight
31 patents (USPTO):Explore Patents

Title: Innovations of Chih-Hao Chen: A Visionary in Semiconductor Packaging

Introduction

Chih-Hao Chen, based in Taipei, Taiwan, is a prominent inventor known for his substantial contributions to the field of semiconductor packaging. With an impressive portfolio of 26 patents, Chen continues to push the boundaries of innovation, significantly impacting the industry.

Latest Patents

Among his recent innovations, Chen's patents include a novel package structure with a metallic layer over the surfaces of multiple semiconductor dies. This innovative package design features first and second components, an underfill layer situated between them, and a strategic metallic layer. The first package component houses semiconductor dies, surrounded by an insulating encapsulation and a redistribution structure that connects them electrically to the second package component. His manufacturing method for this semiconductor package employs a carefully crafted jig composed of a bottom piece and an upper piece, enhancing process efficiency.

Another notable patent focuses on the manufacturing method of semiconductor packages utilizing this jig. The assembly comprises a bottom piece featuring a base, a support plate, and elastic connectors, paired with an upper piece that includes a cap and outer flanges designed to ensure precise alignment and support during production.

Career Highlights

Throughout his career, Chih-Hao Chen has been associated with reputable companies in the semiconductor industry. He has significantly contributed to Taiwan Semiconductor Manufacturing Company Ltd. and Amazing Microelectronic Corporation. His work has not only advanced packaging technology but has also inspired ongoing research and development within these organizations.

Collaborations

Chen has collaborated with esteemed colleagues, including Li-Hui Cheng and Szu-Wei Lu. Their combined expertise has fostered an environment of innovation and excellence, pushing the limits of what is achievable in semiconductor technology.

Conclusion

Chih-Hao Chen exemplifies the spirit of invention and innovation within the semiconductor industry. Through his groundbreaking patents and collaborative efforts, he continues to lead advancements that will shape the future of technology and enhance the performance of semiconductor devices for generations to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…