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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12176261 B1

PDFFull Text
Date of Patent:
Dec. 24, 2024

Filed:

Jul. 21, 2023

Method of fabricating package structure

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chih-Hao Chen, Taipei, TW;

Chin-Fu Kao, Taipei, TW;

Li-Hui Cheng, New Taipei, TW;

Szu-Wei Lu, Hsinchu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

JCIPRNET

Primary Examiner:

Vu A Vu

Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 21/4853 (2013.01); H01L 21/4882 (2013.01); H01L 21/563 (2013.01); H01L 21/6835 (2013.01); H01L 23/3185 (2013.01); H01L 24/16 (2013.01); H01L 2221/68354 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/18161 (2013.01);
Abstract

A structure includes a circuit substrate, a device, a metal layer, a lid and a thermal interface material layer. The device is disposed on and electrically connected to the circuit substrate. The device includes at least one semiconductor die laterally encapsulated by an insulating encapsulation. The metal layer is covering a back surface of the at least one semiconductor die and the insulating encapsulation. The lid is disposed on the circuit substrate, and the lid is adhered to the metal layer through the thermal interface material layer.

Find Patent Forward Citations

Chen, Chih-Hao. (2024). Method of fabricating package structure (U.S. Patent No. 12176261). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12176261

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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