Chien-Hsin Ho

Title: Innovations of Chien-Hsin Ho

Introduction

Chien-Hsin Ho is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in interconnect structures. With a total of five patents to his name, Ho's work has had a considerable impact on the industry.

Latest Patents

One of Ho's latest patents is titled "Interconnect structure without barrier layer on bottom surface of via." This invention provides embodiments and methods for an interconnect structure that includes a via, a trench with an overlapping area at the top of the via, and a first layer of conducting material overlapping with the bottom of the via. The structure also features a second layer of conducting material formed within the via and a third layer formed in the trench. Notably, the second layer is in direct contact with the first layer without a barrier in between, which helps to reduce the contact resistance of the interconnect structure.

Career Highlights

Chien-Hsin Ho is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this company has allowed him to develop innovative solutions that enhance the performance and efficiency of semiconductor devices.

Collaborations

Ho has collaborated with notable coworkers, including Tz-Jun Kuo and Ming-Han Lee. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Chien-Hsin Ho's contributions to semiconductor technology through his innovative patents and collaborations highlight his role as a key inventor in the field. His work continues to influence advancements in interconnect structures, showcasing the importance of innovation in technology.