Taichung, Taiwan

Chiang-Hung Chen


Average Co-Inventor Count = 3.3

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2020-2022

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5 patents (USPTO):Explore Patents

Title: Innovations of Chiang-Hung Chen

Introduction

Chiang-Hung Chen is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on innovative methods for manufacturing semiconductor memory devices.

Latest Patents

One of his latest patents is a method of manufacturing a semiconductor memory device. This invention includes a substrate, an isolation structure, a first gate dielectric layer, a first conductive layer, a second gate dielectric layer, a second conductive layer, and a protective layer. The substrate is designed with an array region and a periphery region, with the isolation structure positioned between these regions. The first gate dielectric layer is located in the array region, while the second gate dielectric layer is in the periphery region. The protective layer is strategically placed between the second conductive layer and the isolation structure. Another notable patent involves a method of fabricating a semiconductor device that includes two seal rings. This method outlines the formation of a first and second seal ring on a substrate, along with a protective layer that covers both seal rings.

Career Highlights

Chiang-Hung Chen is currently employed at Winbond Electronics Corporation, where he continues to innovate in semiconductor technology. His expertise has led to advancements that enhance the performance and reliability of semiconductor devices.

Collaborations

He collaborates with talented coworkers, including Wen Hung and Yu-Kai Liao, contributing to a dynamic and innovative work environment.

Conclusion

Chiang-Hung Chen's contributions to semiconductor technology through his patents and collaborations highlight his role as a key inventor in the industry. His work continues to influence advancements in memory devices and semiconductor manufacturing processes.

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