Company Filing History:
Years Active: 2013-2014
Title: Innovations by Inventor Chia-Wen Lien in Semiconductor Technology
Introduction: Chia-Wen Lien is a notable inventor based in Taoyuan County, Taiwan, with a focus on advancing semiconductor technologies. With three patents to his name, Lien demonstrates a commitment to innovation within the electronics industry, particularly in processes that enhance the efficiency and functionality of semiconductor devices.
Latest Patents: Lien's latest inventions include two significant patents. The first is titled "Method for Supporting Semiconductor Wafer", which outlines a process for securely clamping a semiconductor wafer using a magnetized assembly. This method involves providing a device wafer and a magnetizable ring and carrier, which, when magnetized, create a robust clamp to hold the wafer securely in place.
The second patent is "Thinned Wafer and Fabricating Method Thereof." This invention presents a novel thinning method for wafers, incorporating an anisotropic etching process to create grooves and reinforcing walls while maintaining the structural integrity of the wafer. This innovative approach is key to producing thinner wafers that can still accommodate semiconductor devices effectively.
Career Highlights: Currently, Chia-Wen Lien is associated with United Microelectronics Corporation, a respected player in the semiconductor industry. His contributions have been instrumental in refining the manufacturing processes and improving the reliability of semiconductor products.
Collaborations: Throughout his career, Lien has worked alongside talented colleagues such as Chang-Sheng Hsu and Kuo-Yuh Yang. The collaborative environment at United Microelectronics Corporation fosters innovation and allows for the cross-pollination of ideas among inventors and engineers.
Conclusion: Chia-Wen Lien exemplifies the spirit of innovation within the semiconductor field. With his patents addressing critical aspects of wafer support and thinning processes, Lien continues to make impactful contributions that enhance semiconductor technology. His work not only exemplifies individual ingenuity but also highlights the importance of collaboration in driving forward technological advancements.