The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2013
Filed:
Jun. 25, 2012
Chang-sheng Hsu, Hsinchu, TW;
Kuo-yuh Yang, Hsinchu County, TW;
Li-che Chen, Pingtung County, TW;
Yan-da Chen, Taipei, TW;
Chia-wen Lien, Taoyuan County, TW;
Chang-Sheng Hsu, Hsinchu, TW;
Kuo-Yuh Yang, Hsinchu County, TW;
Li-Che Chen, Pingtung County, TW;
Yan-Da Chen, Taipei, TW;
Chia-Wen Lien, Taoyuan County, TW;
United Microelectronics Corp., Science-Based Industrial Park, Hsin-Chu, TW;
Abstract
A wafer with a eutectic bonding carrier and a method of manufacturing the same are disclosed, wherein the wafer comprises a thinned wafer, a eutectic bonding layer formed on the backside of said thinned wafer, a eutectic bonding carrier attached on said eutectic bonding layer, and a plurality of openings formed at the active side of said thinned wafer and exposing said eutectic bonding layer on the backside of said thinned wafer.