The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2014

Filed:

May. 23, 2012
Applicants:

Chang-sheng Hsu, Hsinchu, TW;

Li-che Chen, Pingtung County, TW;

Kuo-yuh Yang, Hsinchu County, TW;

Chia-wen Lien, Taoyuan County, TW;

Yan-da Chen, Taipei, TW;

Inventors:

Chang-Sheng Hsu, Hsinchu, TW;

Li-Che Chen, Pingtung County, TW;

Kuo-Yuh Yang, Hsinchu County, TW;

Chia-Wen Lien, Taoyuan County, TW;

Yan-Da Chen, Taipei, TW;

Assignee:

United Microelectronics Corp., Science-Based Industrial Park, Hsin-Chu, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for supporting a semiconductor wafer includes providing a device wafer to a magnetizable ring, providing a magnetizable carrier to the device wafer, and magnetizing the magnetizable ring and the magnetizable carrier to form a magnetized clamp having a magnetized ring and magnetized carrier. The magnetized clamp securely clamps the device wafer therebetween.


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