Chia Ching Chen

Title: Innovations by Chia Ching Chen in Semiconductor Technology

Introduction

Chia Ching Chen is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on enhancing semiconductor package devices, which are crucial for modern electronic applications.

Latest Patents

Chia Ching Chen's latest patents include innovative designs for semiconductor package devices and methods of manufacturing them. One of his patents describes a semiconductor package device that consists of a first dielectric layer, a first interconnection layer, a second interconnection layer, and a second dielectric layer. The first dielectric layer features a first surface, a second surface opposite to the first surface, and a lateral surface extending between these two surfaces. The first interconnection layer is embedded within the first dielectric layer, while the second interconnection layer is positioned on the second surface of the first dielectric layer. This layer extends into the first dielectric layer to establish an electrical connection with the first interconnection layer. The second dielectric layer encapsulates both the second surface and the lateral surface of the first dielectric layer, as well as the second interconnection layer.

Career Highlights

Chia Ching Chen is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor packaging technology. His expertise and dedication have positioned him as a key player in the industry.

Collaborations

Chia Ching Chen has collaborated with talented coworkers, including Yi Chuan Ding and Ming-Ze Lin, who contribute to the advancement of semiconductor technologies alongside him.

Conclusion

Chia Ching Chen's contributions to semiconductor technology through his patents and work at Advanced Semiconductor Engineering, Inc. highlight his importance in the field. His innovative designs are paving the way for future advancements in electronic devices.