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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10687419 B1

PDFFull Text
Date of Patent:
Jun. 16, 2020

Filed:

Jun. 13, 2017

Semiconductor package device and method of manufacturing the same

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Ming-Ze Lin, Kaohsiung, TW;

Chia Ching Chen, Kaohsiung, TW;

Yi Chuan Ding, Kaohsiung, TW;

Assignee:

ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/36 (2006.01); H01L 21/00 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 21/56 (2006.01); H01L 21/66 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/02 (2006.01); H01L 23/48 (2006.01); H01L 23/49 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H05K 3/46 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H01L 21/4857 (2013.01); H01L 23/145 (2013.01); H01L 23/49822 (2013.01); H05K 1/115 (2013.01); H05K 3/4623 (2013.01); H01L 2224/16225 (2013.01); H05K 2203/1438 (2013.01);
Abstract

A semiconductor package device includes a first dielectric layer, a first interconnection layer, a second interconnection layer, and a second dielectric layer. The first dielectric layer has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The first interconnection layer is within the first dielectric layer. The second interconnection layer is on the second surface of the first dielectric layer and extends from the second surface of the first dielectric layer into the first dielectric layer to electrically connect to the first interconnection layer. The second dielectric layer covers the second surface and the lateral surface of the first dielectric layer and the second interconnection layer.

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