This inventor holds 4 USPTO granted patents and 1 published patent application. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2020-2026.
Company Filing History:
Years Active: 2020-2026
Title: The Innovations of Ming-Ze Lin
Introduction
Ming-Ze Lin is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on enhancing semiconductor package devices, which are crucial for modern electronic applications.
Latest Patents
One of his latest patents is titled "Semiconductor package device and method of manufacturing the same." This invention includes a first dielectric layer, a first interconnection layer, a second interconnection layer, and a second dielectric layer. The first dielectric layer features a first surface, a second surface opposite to the first surface, and a lateral surface extending between the two. The first interconnection layer is embedded within the first dielectric layer, while the second interconnection layer is positioned on the second surface and extends into the first dielectric layer to connect electrically with the first interconnection layer. The second dielectric layer encapsulates both the second surface and the lateral surface of the first dielectric layer, along with the second interconnection layer.
Career Highlights
Ming-Ze Lin is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor packaging technologies. His expertise and dedication have positioned him as a key player in the industry.
Collaborations
Ming-Ze Lin has collaborated with notable coworkers such as Chia Ching Chen and Yi Chuan Ding. Their combined efforts contribute to the advancement of semiconductor technologies.
Conclusion
Ming-Ze Lin's work in semiconductor packaging has led to significant innovations that enhance electronic devices. His contributions are vital to the ongoing development of technology in this field.