Chia-Cheng Wang

Title: Chia-Cheng Wang and Semiconductor Manufacturing Innovation.

Introduction

Chia-Cheng Wang is an inventor associated with Taiwan Semiconductor Manufacturing Company Ltd. in Taipei, Taiwan. His patent work addresses a semiconductor manufacturing process designed to improve the uniformity and quality of insulating layers.

Latest Patents

Wang is associated with 1 patent, titled “Process for Forming a SAUSG Inter Metal Dielectric Layer by Pre-Coating.” The invention describes forming a silicon oxide coating on the interior walls of a chemical vapor deposition reactor before processing a wafer. A first insulating layer, preferably a sub-atmospheric undoped silicon glass layer formed using TEOS, is then deposited over the semiconductor structure. The coating is intended to improve the insulating layer’s etch-rate uniformity and produce improved via and contact opening profiles.

Career Highlights

Wang’s documented patent contribution focuses on a practical challenge in semiconductor fabrication: achieving consistent etching and well-formed openings in an inter-metal dielectric layer. The process uses a pre-coating step to modify reactor surfaces and support more uniform results.

Collaborations

Wang’s listed coworkers include Been-Hon Lin and Hung-Ju Chien. His patent is associated with Taiwan Semiconductor Manufacturing Company Ltd.

Conclusion

Chia-Cheng Wang’s patent describes a reactor pre-coating technique intended to improve etch uniformity and via/contact profiles, reflecting his contribution to semiconductor manufacturing innovation.