Chi-Yu Wang

Title: Chi-Yu Wang and Semiconductor Packaging Innovation.

Introduction

Chi-Yu Wang is an inventor based in Kaohsiung, Taiwan. His work includes semiconductor packaging and device manufacturing technologies. He is associated with Advanced Semiconductor Engineering, Inc., and is credited with 7 patents.

Latest Patents

Wang’s listed recent patents address ways to connect semiconductor components and improve device packaging.

“Semiconductor Device Package and Method for Manufacturing the Same” describes a package with two electronic devices. A first device has a redistribution layer containing a circuit layer, while a second device is positioned on that layer. The second device includes an encapsulant and a patterned conductive layer, which is configured to connect electrically with the first device’s circuit layer.

“Semiconductor Device and Method for Manufacturing the Same” describes a device containing two semiconductor dies, a dielectric layer, and two redistribution layers. Openings in the dielectric expose bonding pads on each die. The redistribution layers provide separate electrical connections between corresponding pads on the two dies.

Career Highlights

Wang’s listed patent work focuses on semiconductor devices, redistribution layers, electrical interconnections, and manufacturing methods. These technologies are relevant to assembling and connecting components within compact semiconductor packages.

Collaborations

Wang’s listed coworkers include Ming Hsien Chu and Yuan-Ting Lin. His work is associated with Advanced Semiconductor Engineering, Inc., a company active in semiconductor packaging and assembly.

Conclusion

Chi-Yu Wang’s patent portfolio reflects a focus on semiconductor packaging and device integration, with inventions addressing electrical connections and manufacturing processes.