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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10763234 B1

PDFFull Text
Date of Patent:
Sep. 01, 2020

Filed:

Oct. 16, 2018

Semiconductor device structure having semiconductor die bonded to redistribution layer via electrical pad with barrier layer

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Ming Hsien Chu, Kaohsiung, TW;

Chi-Yu Wang, Kaohsiung, TW;

Assignee:

ADVANCED SEMICOMDUCTOR ENGINEERING, INC., Kaohsiung, TW;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Michael Jung

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 24/73 (2013.01); H01L 21/565 (2013.01); H01L 23/3171 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/5383 (2013.01); H01L 24/11 (2013.01); H01L 24/16 (2013.01); H01L 25/0657 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/16059 (2013.01); H01L 2224/16503 (2013.01); H01L 2224/73204 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06548 (2013.01);
Abstract

A wiring structure includes a redistribution layer and an electrical pad. The redistribution layer includes a passivation layer and a metal layer. The metal layer is embedded in the passivation layer, and the passivation layer defines an opening to expose a portion of the metal layer. The electrical pad is disposed in the opening of the passivation layer and on the metal layer. The electrical pad includes a seed layer, a conductive layer, a barrier layer and an anti-oxidation layer.

Find Patent Forward Citations

Chu, Ming. (2020). Semiconductor device structure having semiconductor die bonded to redistribution layer via electrical pad with barrier layer (U.S. Patent No. 10763234). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10763234

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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