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Kaohsiung, Taiwan

Ming Hsien Chu

This inventor holds 4 USPTO granted patents. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2020-2023.

USPTO Granted Patents = 4

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 3(Granted Patents)

Company Filing History:

Advanced Semiconductor Engineering, Inc.

Years Active: 2020-2023

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4 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11784152 - Semiconductor device package and method for manufacturing the same (2023-10-10),

2. 11101237 - Semiconductor device structure having semiconductor die bonded to redistribution layer via electrical pad with barrier layer (2021-08-24),

3. 11037898 - Semiconductor device package and method for manufacturing the same (2021-06-15),

4. 10763234 - Semiconductor device structure having semiconductor die bonded to redistribution layer via electrical pad with barrier layer (2020-09-01),

Profile summary based on public USPTO records.

Please report any incorrect information to [email protected]

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