Chi-Fu Wu

Title: Innovations of Chi-Fu Wu

Introduction

Chi-Fu Wu is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of sensor technology and photosensitive modules. With a total of five patents to his name, Wu continues to push the boundaries of innovation in his industry.

Latest Patents

One of his latest patents is a sensor that includes a substrate, a chip, and a sensing element. The substrate has a plate-like shape and features a surface along with an interconnect structure disposed within it. The chip is embedded in the substrate and is electrically connected to the interconnect structure. The sensing element is located on the surface of the substrate and is electrically connected to the chip through the interconnect structure. Another significant patent is a photosensitive module that comprises a base, an integrated package substrate, and a photosensitive element. The integrated package substrate is connected to the base and contains a plurality of first electronic components housed inside, protecting them from the external environment. The photosensitive element is connected to the base and is designed to receive a light beam traveling along an optical axis.

Career Highlights

Chi-Fu Wu is currently employed at TDK Taiwan Corporation, where he applies his expertise in developing advanced technologies. His work has been instrumental in enhancing the performance and reliability of electronic devices.

Collaborations

He collaborates with talented individuals such as Hao-Yu Wu and Ming-Hung Wu, contributing to a dynamic and innovative work environment.

Conclusion

Chi-Fu Wu's contributions to sensor technology and photosensitive modules highlight his role as a leading inventor in his field. His innovative patents and collaborative efforts continue to shape the future of technology.