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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10903136 B1

PDFFull Text
Date of Patent:
Jan. 26, 2021

Filed:

Nov. 07, 2018

Package structure having a plurality of insulating layers

Applicant:

Tdk Taiwan Corp., Taoyuan, TW;

Inventors:

Ming-Hung Wu, Taoyuan, TW;

Chi-Fu Wu, Taoyuan, TW;

An-Ping Tseng, Taoyuan, TW;

Hao-Yu Wu, Taoyuan, TW;

Assignee:

TDK Taiwan Corp., Taoyuan, TW;

Attorney:

Muncy, Geissler, Olds & Lowe, P.C.

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 23/12 (2006.01); H01L 23/48 (2006.01); H01L 21/4763 (2006.01); H01L 23/373 (2006.01); H01L 23/367 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 23/538 (2006.01); H01L 21/768 (2006.01); H01L 23/498 (2006.01); H01L 23/528 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); H01L 21/486 (2013.01); H01L 21/76804 (2013.01); H01L 21/76877 (2013.01); H01L 23/367 (2013.01); H01L 23/3677 (2013.01); H01L 23/481 (2013.01); H01L 23/49822 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 23/53295 (2013.01); H01L 24/82 (2013.01); H01L 2224/18 (2013.01);
Abstract

A package structure is provided, including a first insulating layer, a second insulating layer, a third insulating layer, and a chip. The second insulating layer is disposed on the first insulating layer, the chip is disposed in the second insulating layer, and the third insulating layer is disposed on the second insulating layer. The heat conductivity of the second insulating layer is lower than the heat conductivity of the first insulating layer, and the hardness of the second insulating layer is lower than the hardness of the first insulating layer.

Find Patent Forward Citations

Wu, Ming-Hung. (2021). Package structure having a plurality of insulating layers (U.S. Patent No. 10903136). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10903136

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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