An-Ping Tseng

Title: An-Ping Tseng: Innovator in Sensor Technology

Introduction

An-Ping Tseng is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of sensor technology, holding a total of five patents. His work focuses on innovative designs that enhance the functionality and efficiency of sensors and related technologies.

Latest Patents

An-Ping Tseng's latest patents include a novel sensor design that features a substrate, a chip, and a sensing element. The substrate is plate-like and incorporates a surface along with an interconnect structure. The chip is embedded within the substrate and is electrically connected to the interconnect structure. The sensing element is positioned on the substrate's surface and connects to the chip via the interconnect structure. Another recent patent involves a package structure that consists of multiple insulating layers. This package includes a first insulating layer, a second insulating layer, a third insulating layer, and a chip. The second insulating layer is placed on the first, with the chip embedded within it, while the third insulating layer is positioned on top. Notably, the second insulating layer has lower heat conductivity and hardness compared to the first insulating layer.

Career Highlights

An-Ping Tseng has worked with TDK Taiwan Corporation, where he has applied his expertise in sensor technology. His career reflects a commitment to advancing the field through innovative solutions and practical applications.

Collaborations

An-Ping Tseng has collaborated with notable individuals in his field, including Chi-Fu Wu and Hao-Yu Wu. These collaborations have likely contributed to the development of his innovative patents and advancements in sensor technology.

Conclusion

An-Ping Tseng is a distinguished inventor whose work in sensor technology has led to multiple patents and significant advancements in the field. His innovative designs continue to influence the industry and pave the way for future developments.