The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2023
Filed:
Jun. 04, 2019
Applicant:
Tdk Taiwan Corp., Taoyuan, TW;
Inventors:
An-Ping Tseng, Taoyuan, TW;
Chi-Fu Wu, Taoyuan, TW;
Hao-Yu Wu, Taoyuan, TW;
Ming-Hung Wu, Taoyuan, TW;
Chun-Yang Tai, Taoyuan, TW;
Tsutomu Fukai, Taoyuan, TW;
Assignee:
TDK TAIWAN CORP., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 23/538 (2006.01); H01L 23/64 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); B81B 7/00 (2006.01); H01L 23/13 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); B81B 7/0061 (2013.01); H01L 21/4857 (2013.01); H01L 21/6835 (2013.01); H01L 23/04 (2013.01); H01L 23/13 (2013.01); H01L 23/49816 (2013.01); H01L 23/5383 (2013.01); H01L 23/5389 (2013.01); H01L 23/642 (2013.01); B81B 2201/0257 (2013.01); B81B 2207/012 (2013.01); B81B 2207/07 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48228 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1461 (2013.01);
Abstract
A sensor is provided, including a substrate, a chip and a sensing element. The substrate has a plate-like shape and includes a surface and an interconnect structure disposed in the substrate. The chip is embedded in the substrate and is electrically connected to the interconnect structure. The sensing element is disposed on the surface of the substrate, and is electrically connected to the chip through the interconnect structure.