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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11355656 B1

PDFFull Text
Date of Patent:
Jun. 07, 2022

Filed:

Apr. 17, 2020

Photosensitive module

Applicant:

Tdk Taiwan Corp., Taoyuan, TW;

Inventors:

Chen-Er Hsu, Taoyuan, TW;

Sin-Jhong Song, Taoyuan, TW;

Chi-Fu Wu, Taoyuan, TW;

Hao-Yu Wu, Taoyuan, TW;

Tsutomu Fukai, Taoyuan, TW;

Ming-Hung Wu, Taoyuan, TW;

Assignee:

TDK TAIWAN CORP., Taoyuan, TW;

Attorney:

Muncy, Geissler, Olds & Lowe, P.C.

Primary Examiner:

Kenneth Parker

Assistant Examiner:

Long H Le

Int. Cl.
CPC ...
A61B 5/11 (2006.01); A61B 5/103 (2006.01); A61B 5/00 (2006.01); H01L 31/0232 (2014.01); H01L 31/113 (2006.01); H01L 31/0236 (2006.01); H01L 31/02 (2006.01); H01L 27/146 (2006.01); H01L 31/0224 (2006.01); H01L 31/024 (2014.01); G03B 5/00 (2021.01); H04N 5/225 (2006.01); G03B 5/02 (2021.01); G03B 5/04 (2021.01); G02B 7/182 (2021.01); H02K 11/21 (2016.01); G02B 7/09 (2021.01); G02B 27/64 (2006.01); G03B 13/36 (2021.01); H02K 41/035 (2006.01); G02B 7/00 (2021.01); H01L 23/00 (2006.01); G02B 13/00 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02327 (2013.01); G02B 7/003 (2013.01); G02B 7/09 (2013.01); G02B 7/1821 (2013.01); G02B 27/646 (2013.01); G03B 5/00 (2013.01); G03B 5/02 (2013.01); G03B 5/04 (2013.01); G03B 13/36 (2013.01); H01L 27/14618 (2013.01); H01L 27/14636 (2013.01); H01L 31/02002 (2013.01); H01L 31/024 (2013.01); H01L 31/02016 (2013.01); H01L 31/02366 (2013.01); H01L 31/022466 (2013.01); H01L 31/1136 (2013.01); H02K 11/21 (2016.01); H02K 41/0356 (2013.01); H04N 5/2253 (2013.01); H04N 5/2254 (2013.01); H04N 5/2257 (2013.01); G02B 13/0045 (2013.01); G03B 2205/0007 (2013.01); G03B 2205/0069 (2013.01); H01L 24/48 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48225 (2013.01);
Abstract

A photosensitive module is provided. The photosensitive module includes a base, an integrated package substrate, and a photosensitive element. The integrated package substrate is connected to the base. The integrated package substrate has a plurality of first electronic components, and the first electronic components are housed inside the integrated package substrate without being exposed to external environment. The photosensitive element is connected to the base, and the photosensitive element is configured to receive a light beam traveling along an optical axis.

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